Tunable temperature controlled substrate support assembly

ABSTRACT

Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims benefit of U.S. Provisional Application Ser. No.62/028,693, filed on Jul. 24, 2014 (Attorney Docket No. APPM/21836USL03) and U.S. Provisional Application Ser. No. 62/028,260, filed onJul. 23, 2014 (Attorney Docket No. APPM/21836 USL02), both of which areincorporated by reference in their entirety.

BACKGROUND

1. Field

Implementations described herein generally relate to semiconductormanufacturing and more particularly to temperature controlled substratesupport assembly and method of using the same.

2. Description of the Related Art

As the feature size of the device patterns get smaller, the criticaldimension (CD) requirements of these features become a more importantcriterion for stable and repeatable device performance. Allowable CDvariation across a substrate processed within a processing chamber isdifficult to achieve due to chamber asymmetries such as chamber andsubstrate temperature, flow conductance, and RF fields.

In processes utilizing an electrostatic chuck, uniformity of temperaturecontrol across the surface of the substrate is even more challenging dueto the non-homogeneous construction of the chuck below the substrate.For example, some regions of the electrostatic chuck have gas holes,while other regions have lift pin holes that are laterally offset fromthe gas holes. Still other regions have chucking electrodes, while otherregions have heater electrodes that are laterally offset from thechucking electrodes. Since the structure of the electrostatic chuck canvary both laterally and azimuthally, uniformity of heat transfer betweenthe chuck and substrate is complicated and very difficult to obtain,resulting in local hot and cold spots across the chuck surface, whichconsequently result in non-uniformity of processing results along thesurface of the substrate.

The lateral and azimuthal uniformity of heat transfer between the chuckand substrate is further complicated by heat transfer schemes commonlyutilized in conventional substrate supports to which the electrostaticchuck is mounted. For example, conventional substrate supports typicallyhave only edge to center temperature control. Thus, local hot and coldspots within the electrostatic chuck cannot be compensated for whileutilizing the heat transfer features of the conventional substratesupports.

Thus, there is a need for an improved substrate support assembly.

SUMMARY

Implementations described herein provide a substrate support assemblywhich enables both lateral and azimuthal tuning of the heat transferbetween an electrostatic chuck and a heating assembly. The substratesupport assembly comprises a body having a substrate support surface anda lower surface, one or more main resistive heaters disposed in thebody, a plurality of spatially tunable heaters disposed in the body, anda tuning heater controller coupled to the plurality of spatially tunableheaters, the tuning heater controller configured to independentlycontrol an output for one of the plurality of spatially tunable heatersrelative to another of the plurality of spatially tunable heaters.

In one embodiment, a substrate support assembly comprises a substrate acooling base with slots formed therethrough, a body having a substratesupport surface and a lower surface, one or more main resistive heatersdisposed in the body, a plurality of spatially tunable heaters disposedin the body, and a tunable heater controller coupled to the plurality ofspatially tunable heaters, the tuning heater controller configured toindependently control an output for one of the plurality of spatiallytunable heaters relative to another of the plurality of spatiallytunable heaters.

In yet another embodiment, a method for controlling the temperature of aworkpiece is provided. The method, includes applying power to a mainresistive heater formed in a substrate support; providing power to aplurality of spatially tunable heaters, wherein power to each spatiallytunable heater is individually controlled by a tuning heater controller;processing a workpiece on the substrate support; and changing the powerprovided to individual spatially tunable heater in response to processconditions or changes in a process recipe.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the presentinvention can be understood in detail, a more particular description ofthe invention, briefly summarized above, may be had by reference toimplementations, some of which are illustrated in the appended drawings.It is to be noted, however, that the appended drawings illustrate onlytypical implementations of this invention and are therefore not to beconsidered limiting of its scope, for the invention may admit to otherequally effective implementations.

FIG. 1 is a cross-sectional schematic side view of a processing chamberhaving one embodiment of a substrate support assembly;

FIG. 2 is a partial cross-sectional schematic side view detailingportions of the substrate support assembly;

FIG. 3A-3E are partial schematic side views of illustrating variouslocations for spatially tunable heaters and main resistive heaterswithin the substrate support assembly;

FIG. 4A is a cross-sectional view taken along a section line A-A of FIG.2;

FIGS. 4B-4D are cross-sectional views taken along the section line A-Aof FIG. 2, illustrating alternative layouts for spatially tunableheaters;

FIG. 5 is a graphical depiction for a wiring schema for the spatiallytunable heaters and main resistive heaters;

FIG. 6 is a graphical depiction for an alternate wiring schema for thespatially tunable heaters and main resistive heaters;

FIG. 7 is a bottom perspective view of the substrate support assembly,configured for the wiring schema depicted in FIG. 6;

FIG. 8 is a bottom perspective view for the cooling base, configured forthe wiring schema depicted in FIG. 6;

FIG. 9 is a flow diagram of one embodiment of a method for processing asubstrate utilizing a substrate support assembly; and

FIG. 10 is a cross-sectional view for a mating connecter for connectingthe electrostatic chuck to a controller.

To facilitate understanding, identical reference numerals have beenused, where possible, to designate identical elements that are common tothe figures. It is contemplated that elements disclosed in oneimplementation may be beneficially used in other implementations withoutspecific recitation.

DETAILED DESCRIPTION

Implementations described herein provide a substrate support assemblywhich enables both lateral and azimuthal tuning of the temperature of anelectrostatic chuck comprising the substrate support assembly, which inturn, allows both lateral and azimuthal tuning of the lateraltemperature profile of a substrate processed on the substrate supportassembly. Moreover, the substrate support assembly also enables localhot or cold spots on the substrate to be substantially eliminated.Methods for tuning of a lateral temperature profile a substrateprocessed on a substrate support assembly are also described herein.Although the substrate support assembly is described below in an etchprocessing chamber, the substrate support assembly may be utilized inother types of plasma processing chambers, such as physical vapordeposition chambers, chemical vapor deposition chambers, ionimplantation chambers, among others, and other systems where azimuthaltuning of a lateral temperature profile is desirable. It is alsocontemplated that the spatially tunable heaters may also be utilized tocontrol the temperature of other surfaces, including those not used forsemiconductor processing.

In one or more embodiments, the substrate support assembly allows forthe correction of critical dimension (CD) variation at the edge of thesubstrate during vacuum process, such as etching, deposition,implantation and the like, by allowing the substrate temperature to beutilized to compensate for chamber non-uniformities, such astemperature, flow conductance, electrical fields, plasma density and thelike. Additionally, some embodiments have demonstrated the ability tocontrol the temperature uniformity across the substrate to less thanabout ±0.3 degrees Celsius.

FIG. 1 is a cross-sectional schematic view of an exemplary etchprocessing chamber 100 having a substrate support assembly 126. Asdiscussed above, the substrate support assembly 126 may be utilized inother processing chamber, for example plasma treatment chambers,annealing chambers, physical vapor deposition chambers, chemical vapordeposition chambers, and ion implantation chambers, among others, aswell as other systems where the ability to control a temperature profileof a surface or workpiece, such as a substrate, is desirable.Independent and local control of the temperature across many discreteregions across a surface beneficially enables azimuthal tuning of thetemperature profile, center to edge tuning of the temperature profile,and reduction of local temperature asperities, such as hot and coolspots.

The processing chamber 100 includes a grounded chamber body 102. Thechamber body 102 includes walls 104, a bottom 106 and a lid 108 whichenclose an internal volume 124. The substrate support assembly 126 isdisposed in the internal volume 124 and supports a substrate 134 thereonduring processing.

The walls 104 of the processing chamber 100 include an opening (notshown) through which the substrate 134 may be robotically transferredinto and out of the internal volume 124. A pumping port 110 is formed inone of the walls 104 or the bottom 106 of the chamber body 102 and isfluidly connected to a pumping system (not shown). The pumping system isutilized to maintain a vacuum environment within the internal volume 124of the processing chamber 100, while removing processing byproducts.

A gas panel 112 provides process and/or other gases to the internalvolume 124 of the processing chamber 100 through one or more inlet ports114 formed through at least one of the lid 108 or walls 104 of thechamber body 102. The process gas provided by the gas panel 112 areenergized within the internal volume 124 to form a plasma 122 utilizedto process the substrate 134 disposed on the substrate support assembly126. The process gases may be energized by RF power inductively coupledto the process gases from a plasma applicator 120 positioned outside thechamber body 102. In the embodiment depicted in FIG. 1, the plasmaapplicator 120 is a pair of coaxial coils coupled through a matchingcircuit 118 to an RF power source 116.

A controller 148 is coupled to the processing chamber 100 to controloperation of the processing chamber 100 and processing of the substrate134. The controller 148 may be one of any form of general-purpose dataprocessing system that can be used in an industrial setting forcontrolling the various subprocessors and subcontrollers. Generally, thecontroller 148 includes a central processing unit (CPU) 172 incommunication with memory 174 and input/output (I/O) circuitry 176,among other common components. Software commands executed by the CPU ofthe controller 148, cause the processing chamber to, for example,introduce an etchant gas mixture (i.e., processing gas) into theinternal volume 124, form the plasma 122 from the processing gas byapplication of RF power from the plasma applicator 120, and etch a layerof material on the substrate 134.

The substrate support assembly 126 generally includes at least asubstrate support 132. The substrate support 132 may be a vacuum chuck,an electrostatic chuck, a susceptor, or other workpiece support surface.In the embodiment of FIG. 1, the substrate support 132 is anelectrostatic chuck and will be described hereinafter as theelectrostatic chuck 132. The substrate support assembly 126 mayadditionally include a heater assembly 170. The substrate supportassembly 126 may also include a cooling base 130. The cooling base mayalternately be separate from the substrate support assembly 126. Thesubstrate support assembly 126 may be removably coupled to a supportpedestal 125. The support pedestal 125, which may include a pedestalbase 128 and a facility plate 180, is mounted to the chamber body 102.The substrate support assembly 126 may be periodically removed from thesupport pedestal 125 to allow for refurbishment of one or morecomponents of the substrate support assembly 126.

The facility plate 180 is configured to accommodate a plurality ofdriving mechanism configured to raise and lower a plurality of liftingpins. Additionally, the facility plate 180 is configured to accommodatethe plurality of fluid connections from the electrostatic chuck 132 andthe cooling base 130. The facility plate 180 is also configured toaccommodate the plurality of electrical connections from theelectrostatic chuck 132 and the heater assembly 170. The myriad ofconnections may run externally or internally of the substrate supportassembly 126 while the facility plate 180 provides an interface for theconnections to a respective terminus.

The electrostatic chuck 132 has a mounting surface 131 and a workpiecesurface 133 opposite the mounting surface 131. The electrostatic chuck132 generally includes a chucking electrode 136 embedded in a dielectricbody 150. The chucking electrode 136 may be configured as a mono polaror bipolar electrode, or other suitable arrangement. The chuckingelectrode 136 is coupled through an RF filter 182 to a chucking powersource 138 which provides a RF or DC power to electrostatically securethe substrate 134 to the upper surface of the dielectric body 150. TheRF filter 182 prevents RF power utilized to form a plasma 122 within theprocessing chamber 100 from damaging electrical equipment or presentingan electrical hazard outside the chamber. The dielectric body 150 may befabricated from a ceramic material, such as AlN or Al₂O₃. Alternately,the dielectric body 150 may be fabricated from a polymer, such aspolyimide, polyetheretherketone, polyaryletherketone and the like.

The workpiece surface 133 of the electrostatic chuck 132 may include gaspassages (not shown) for providing backside heat transfer gas to theinterstitial space defined between the substrate 134 and the workpiecesurface 133 of the electrostatic chuck 132. The electrostatic chuck 132may also include lift pin holes for accommodating lift pins (both notshown) for elevating the substrate 134 above the workpiece surface 133of the electrostatic chuck 132 to facilitate robotic transfer into andout of the processing chamber 100.

The temperature controlled cooling base 130 is coupled to a heattransfer fluid source 144. The heat transfer fluid source 144 provides aheat transfer fluid, such as a liquid, gas or combination thereof, whichis circulated through one or more conduits 160 disposed in the coolingbase 130. The fluid flowing through neighboring conduits 160 may beisolated to enabling local control of the heat transfer between theelectrostatic chuck 132 and different regions of the cooling base 130,which assists in controlling the lateral temperature profile of thesubstrate 134.

A fluid distributor may be fluidly coupled between an outlet of the heattransfer fluid source 144 and the temperature controlled cooling base130. The fluid distributor operates to control the amount of heattransfer fluid provided to the conduits 160. The fluid distributor maybe disposed outside of the processing chamber 100, within the substratesupport assembly 126, within the pedestal base 128 or other suitablelocation.

The heater assembly 170 may include one or more main resistive heaters154 and/or a plurality of spatially tunable heaters 140 embedded in abody 152. The main resistive heaters 154 may be provided to elevate thetemperature of the substrate support assembly 126 to a temperature forconducting chamber processes. The spatially tunable heaters 140 arecomplimentary to the main resistive heaters 154 and configured to adjustthe localized temperature of the electrostatic chuck 132 in a pluralityof discrete locations within any one or more of a plurality of laterallyseparated heating zones defined by the main resistive heaters 154. Thespatially tunable heaters 140 provide localized adjustments to thetemperature profile of a substrate placed on the substrate supportassembly 126. Thus, the main resistive heaters 154 operate on aglobalized macro scale while the spatially tunable heaters 140 operateon a localized micro scale.

The main resistive heaters 154 are coupled through an RF filter 184 to amain heater power source 156. The power source 156 may provide 900 wattsor more power to the main resistive heaters 154. The controller 148 maycontrol the operation of the main heater power source 156, which isgenerally set to heat the substrate 134 to about a predefinedtemperature. In one embodiment, the main resistive heaters 154 includelaterally separated heating zones, wherein the controller 148 enablesone zone of the main resistive heaters 154 to be preferentially heatedrelative to the main resistive heaters 154 located in one or more of theother zones. For example, the main resistive heaters 154 may be arrangedconcentrically in a plurality of separated heating zones.

The spatially tunable heaters 140 are coupled through an RF filter 186to a tuning heater power source 142. The tuning heater power source 142may provide 10 watts or less power to the spatially tunable heaters 140.In one embodiment, the power supplied by the tuning heater power source142 is an order of magnitude less than the power supplied by the powersource 156 of the main resistive heaters. The spatially tunable heaters140 may additionally be coupled to a tuning heater controller 202. Thetuning heater controller 202 may be located within or external to thesubstrate support assembly 126. The tuning heater controller 202 maymanage the power provided from the tuning heater power source 142 toindividual or groups of spatially tunable heaters 140 in order tocontrol the heat generated locally at each spatially tunable heaters 140distributed laterally across the substrate support assembly 126. Thetuning heater controller 202 is configured to independently control anoutput one of the plurality of spatially tunable heaters 140 relative toanother of the plurality of spatially tunable heaters 140. An opticalconverter 178 may coupled the tuning heater controller 202 to thecontroller 148 to decouple the controller 148 from influence of the RFenergy with the processing chamber 100.

In one embodiment, the one or more main resistive heaters 154, and/orthe spatially tunable heaters 140, may be formed in the electrostaticchuck 132. The substrate support assembly 126 may be formed without theheater assembly 170 with the electrostatic chuck 132 disposed directlyon the cooling base 130. The tuning heater controller 202 may bedisposed adjacent to the cooling base and selectively control individualspatially tunable heaters 140.

The electrostatic chuck 132 may include one or more temperature sensors(not shown) for providing temperature feedback information to thecontroller 148 for controlling the power applied by the main heaterpower source 156 to the main resistive heaters 154, for controlling theoperations of the cooling base 130, and controlling the power applied bythe tuning heater power source 142 to the spatially tunable heaters 140.

The temperature of the surface for the substrate 134 in the processingchamber 100 may be influenced by the evacuation of the process gasses bythe pump, the slit valve door, the plasma 122 and other factors. Thecooling base 130, the one or more main resistive heaters 154, and thespatially tunable heaters 140 all help to control the surfacetemperature of the substrate 134.

In a two zone configuration of main resistive heaters 154, the mainresistive heaters 154 may be used to heat the substrate 134 to atemperature suitable for processing with a variation of about +/−10degrees Celsius from one zone to another. In a four zone assembly forthe main resistive heaters 154, the main resistive heaters 154 may beused to heat the substrate 134 to a temperature suitable for processingwith a variation of about +/−1.5 degrees Celsius within a particularzone. Each zone may vary from adjacent zones from about 0 degreesCelsius to about 20 degrees Celsius depending on process conditions andparameters. However, the requirement for minimizing variations in thecritical dimensions across a substrate has reduced the acceptablevariation in a determined process temperature of the surface of thesubstrate surface. A half a degree variation of the surface temperaturefor the substrate 134 may result in as much as a nanometer difference inthe formation of structures therein. The spatially tunable heaters 140improve the temperature profile of the surface of the substrate 134produced by the main resistive heaters 154 by reducing variations in thetemperature profile to about +/−0.3 degrees Celsius. The temperatureprofile may be made uniform or to vary precisely in a predeterminedmanner across regions of the substrate 134 through the use of thespatially tunable heaters 140 to obtain desired results.

FIG. 2 is a partial cross-sectional schematic view illustrating portionsof the substrate support assembly 126. Included in FIG. 2 are portionsof the electrostatic chuck 132, the cooling base 130, heater assembly170 and the facility plate 180.

The body 152 of the heater assembly 170 may be fabricated from a polymersuch as a polyimide. The body 152 may generally be cylindrical in planform, but may also be formed in other geometrical shapes. The body 152has an upper surface 270 and a lower surface 272. The upper surface 270faces the electrostatic chuck 132, while the lower surface 272 faces thecooling base 130.

The body 152 of the heater assembly 170 may be formed from two or moredielectric layers (shown in FIG. 2 as three dielectric layers 260, 262,264) and heating the layers 260, 262, 264 under pressure to form asingle body 152. For example, the body 152 may be formed from polyimidelayers 260, 262, 264, which separate the main and spatially tunableheaters 154, 140, which are heated under pressure to form the singlebody 152 of the heater assembly 170. The spatially tunable heaters 140may be placed in, on or between the first, second or third layers 260,262, 264 prior to forming the body 152. Additionally, the main resistiveheaters 154 may be placed in, on or between on the first, second orthird layers 260, 262, 264 prior to assembly, with at least one of thelayers 260, 262, 264 separating and electrically insulating the heaters154, 140. In this manner, the spatially tunable heaters 140 and the mainresistive heaters 154 become an integral part of the heater assembly170.

Alternate configurations for locations of the main resistive heaters 154and the spatially tunable heaters 140 may place one or both heaters 154,140 in or under the electrostatic chuck 132. FIGS. 3A-3E are partialschematic views of the substrate support assembly 126 detailing variouslocations for the spatially tunable heaters 140 and the main resistiveheaters 154, although not limiting to all embodiments.

In the embodiment depicted in FIG. 3A, the substrate support assembly126 does not have a heater assembly (170) and the spatially tunableheaters 140 and the main resistive heaters 154 are disposed in theelectrostatic chuck 132, for example, below the chucking electrode 136.Although the spatially tunable heaters 140 are shown below the mainresistive heaters 154, the spatially tunable heaters 140 may bealternatively positioned above the main resistive heaters 154. In theembodiment depicted in FIG. 3B, the heater assembly 170 for thesubstrate support assembly 126 includes the spatially tunable heaters140 while the main resistive heaters 154 are disposed in theelectrostatic chuck 132, for example, below the chucking electrode 136.Alternatively, the spatially tunable heaters 140 may be disposed in theelectrostatic chuck 132 while the main resistive heaters 154 aredisposed in the heater assembly 170. In the embodiment depicted in FIG.3C, the heater assembly 170 for the substrate support assembly 126 hasthe main resistive heaters 154 disposed therein. The spatially tunableheaters 140 are disposed in the electrostatic chuck 132, for example,below the chucking electrode 136. In the embodiment depicted in FIG. 3D,the heater assembly 170 for the substrate support assembly 126 hasspatially tunable heaters 140 disposed therein while the main resistiveheaters 154 are disposed on one of the heater assembly 170 or theelectrostatic chuck 132. The heater assembly 170 isolates the spatiallytunable heaters 140 from the cooling base 130. In the embodimentdepicted in FIG. 3E, the heater assembly 170 of the substrate supportassembly 126 has main resistive heaters 154 disposed therein. Thespatially tunable heaters 140 are disposed in or on the heater assembly170, for example, below the electrostatic chuck 132. It is contemplatedthat the spatially tunable heaters 140 and the main resistive heaters154 may be arranged in other orientations. For example, the substratesupport assembly 126 may only have the plurality of spatially tunableheaters 140 for heating the substrate 134. In one embodiment, thespatially tunable heaters 140 and the main resistive heaters 154 aredisposed directly under each other within substrate support assembly126. The spatially tunable heaters 140 provide fine tune control for thetemperature profile of the substrate 134 supported by the substratesupport assembly 126.

Returning back to FIG. 2, the spatially tunable heaters 140 may beformed or disposed on or in the body 152 of the heater assembly 170 orelectrostatic chuck 132. The spatially tunable heaters 140 may be formedby plating, ink jet printing, screen printing, physical vapordeposition, stamping, wire mesh, pattern polyimide flex circuit, or byother suitable manner. Vias may be formed in the heater assembly 170 orelectrostatic chuck 132 for providing connections from the spatiallytunable heaters 140 to an exterior surface of the heater assembly 170 orelectrostatic chuck 132. For example, the body 150 of the electrostaticchuck 132 has vias formed therein between the spatially tunable heaters140 and the mounting surface 131 of the body 150. Alternately, the body152 of the heater assembly 170 has vias formed therein between thespatially tunable heaters 140 and a surface of the body 152 adjacent thecooling base 130. In this manner fabrication of the substrate supportassembly 126 is simplified. In one embodiment, the spatially tunableheaters 140 are disposed within the heater assembly 170 while formingthe heater assembly 170. In another embodiment, the spatially tunableheaters 140 are directly disposed on the mounting surface 131 of theelectrostatic chuck 132. For example, the spatially tunable heaters 140may be in a sheet form which can be adhered to the mounting surface 131of the electrostatic chuck 132, or the spatially tunable heaters may bedeposited by other means. For example, the spatially tunable heaters 140can be deposited on the mounting surface 131 by physical vapordeposition, chemical vapor deposition, screen printing or other suitablemethods. The main resistive heaters 154 can be in the electrostaticchuck 132 or heater assembly 170 as shown above.

The main resistive heaters 154 may be formed or disposed on or in thebody 152 of the heater assembly 170 or electrostatic chuck 132. The mainresistive heaters 154 may be formed by plating, ink jet printing, screenprinting, physical vapor deposition, stamping, wire mesh or othersuitable manner. In this manner fabrication of the substrate supportassembly 126 is simplified. In one embodiment, main resistive heaters154 are disposed within the heater assembly 170 while forming the heaterassembly 170. In another embodiment, main resistive heaters 154 aredirectly disposed on the mounting surface 131 of the electrostatic chuck132. For example, main resistive heaters 154 may be in a sheet formwhich can be adhered to the mounting surface 131 of the electrostaticchuck 132, or main resistive heaters 154 may be deposited by othermeans. For example, main resistive heaters 154 can be deposited on themounting surface 131 by physical vapor deposition, chemical vapordeposition, screen printing or other suitable methods. The spatiallytunable heaters 140 can be in the electrostatic chuck 132 or heaterassembly 170 as shown above.

In some embodiments, the main resistive heaters 154 may be fabricatedsimilar to the spatially tunable heaters 140, and in such embodiments,may optionally be utilized without benefit of additional spatiallytunable heaters 140. In other words, the main resistive heaters 154 ofthe substrate support assembly 126 may themselves be spatially tunable,that is, segmented in to a plurality of discreet resistive heatingelements. Segmenting the main resistive heaters 154 in the form of smallresistive heaters allows local control of hot and cold spots on thesurface of the substrate 134. An additional layer of spatially tunableheaters 140 is optional, depending on the desired level of temperaturecontrol.

The heater assembly 170 may be coupled to the mounting surface 131 ofthe electrostatic chuck 132 utilizing a bonding agent 244. The bondingagent 244 may be an adhesive, such as an acrylic-based adhesive, anepoxy, a silicon based adhesive, a neoprene-based adhesive or othersuitable adhesive. In one embodiment, the bonding agent 244 is an epoxy.The bonding agent 244 may have a coefficient of thermal conductivityselected in a range from 0.01 to 200 W/mK and, in one exemplaryembodiment, in a range from 0.1 to 10 W/mK. The adhesive materialscomprising the bonding agent 244 may additionally include at least onethermally conductive ceramic filler, e.g., aluminum oxide (Al₂O₃),aluminum nitride (AlN), and titanium diboride (TiB₂), and the like.

In one embodiment, the heater assembly 170 is coupled to the coolingbase 130 utilizing a bonding agent 242. The bonding agent 242 may besimilar to the bonding agent 244 and may be an adhesive, such as anacrylic-based adhesive, an epoxy, a neoprene-based adhesive or othersuitable adhesive. In one embodiment, the bonding agent 242 is an epoxy.The bonding agent 242 may have a coefficient of thermal conductivityselected in a range from 0.01 to 200 W/mK and, in one exemplaryembodiment, in a range from 0.1 to 10 W/mK. The adhesive materialscomprising the bonding agent 242 may additionally include at least onethermally conductive ceramic filler, e.g., aluminum oxide (Al₂O₃),aluminum nitride (AlN), and titanium diboride (TiB₂), and the like.

The bonding agents 244, 242 may be removed when refurbishing one or bothof the electrostatic chuck 132, the cooling base 130 and the heaterassembly 170. In other embodiments, the heater assembly 170 is removablycoupled to the electrostatic chuck 132 and to the cooling base 130utilizing fasteners or clamps (not shown).

The heater assembly 170 includes a plurality of spatially tunableheaters 140, illustratively shown as spatially tunable heaters 140 a,140 b, 140 c. The spatially tunable heaters 140 are generally anenclosed volume within the heater assembly 170 in which a plurality ofresistive heaters effectuate heat transfer between the heater assembly170 and electrostatic chuck 132. Each spatially tunable heater 140 maybe laterally arranged across the heater assembly 170 and thus defined acell 200 within the heater assembly 170 for locally providing additionalheat to region of the heater assembly 170 (and portion of the mainresistive heater 154) aligned that cell 200. The number of spatiallytunable heaters 140 formed in the heater assembly 170 may vary, and itis contemplated that there is at least an order of magnitude morespatially tunable heaters 140 (and cells 200) greater than the number ofthe main resistive heaters 154. In one embodiment in which the heaterassembly 170 has four main resistive heaters 154, there may be greaterthan 40 spatially tunable heaters 140. However, it is contemplated thatthere may be about 200, about 400 or even more spatially tunable heaters140 in a given embodiment of a substrate support assembly 126 configuredfor use with a 300 mm substrate. Exemplary distribution of the spatiallytunable heaters 140 are described further below with reference to FIGS.4A-4D.

The cells 200 may be formed through one or more layers 260, 262, 264comprising the body 152 of the heater assembly 170. In one embodiment,the cells are open to the lower and upper surface 272, 272 of the body152. The cells may include sidewalls 214. The sidewalls 214 may becomprised of a material (or gap) acting as a thermal choke 216. Thethermal chokes 216 are formed in the upper surface 270 of the body 152.The thermal chokes 216 separate and reduce conduction between adjacentcells 200. Thus, by individually and independently controlling the powerprovided to each spatially tunable heaters 140, and consequently theheat transfer through cell 200, a pixel by pixel approach to temperaturecontrol can be realized which enables specific points of the substrate134 to be heated or cooled, thereby enabling a truly addressable lateraltemperature profile tuning and control of the surface of the substrate134.

An additional thermal choke 216 may be formed between the radiallyoutermost cells 200 and a laterally outermost sidewall 280 of the body152. This outermost thermal choke 216 located between the cells 200 andthe laterally outermost sidewall 280 of the body 152 minimizes heattransfer between the cells 200, adjacent to the laterally outermostsidewall 280, and the internal volume 124 of the processing chamber 100.Thereby allowing more precise temperature control closer to the edge ofthe substrate support assembly 126, and as a result, better temperaturecontrol to the outside diameter edge of the substrate 134.

Each spatially tunable heater 140 may be independently coupled to thetuning heater controller 202. The tuning heater controller 202 may bedisposed in the substrate support assembly 126. The tuning heatercontroller 202 may regulate the temperature of the spatially tunableheaters 140 in the heater assembly 170 at each cell 200 relative to theother cells 200, or alternatively, regulate the temperature of a groupof spatially tunable heaters 140 in the heater assembly 170 across agroup of cells 200 relative to the another group of cells 200. Thetuning heater controller 202 may toggle the on/off state or control theduty cycle for individual spatially tunable heaters 140. Alternately,the tuning heater controller 202 may control the amount of powerdelivered to the individual spatially tunable heaters 140. For example,the tuning heater controller 202 may provide one or more spatiallytunable heaters 140 ten watts of power, other spatially tunable heaters140 nine watts of power, and still other spatially tunable heaters 140one watt of power.

In one embodiment, each cell 200 may be thermally isolated from theneighboring cells 200, for example, using a thermal choke 216, whichenables more precise temperature control. In another embodiment, eachcell 200 may be thermally joined to an adjacent cell creating ananalogue (i.e., smooth or blended) temperature profile along an uppersurface 270 of the heater assembly 170. For example, a metal layer, suchas aluminum foil, may be used as a thermal spreader between the mainresistive heaters 154 and the spatially tunable heaters 140.

The use of independently controllable spatially tunable heaters 140 tosmooth out or correct the temperature profile generated by the mainresistive heaters 154 enable control of the local temperature uniformityacross the substrate to very small tolerances, thereby enabling preciseprocess and CD control when processing the substrate 134. Additionally,the small size and high density of the spatially tunable heaters 140relative to the main resistive heaters 154 enables temperature controlat specific locations on the substrate support assembly 126,substantially without affecting the temperature of neighboring areas,thereby allowing local hot and cool spots to be compensated for withoutintroducing skewing or other temperature asymmetries. The substratesupport assembly 126, having a plurality of spatially tunable heaters140, has demonstrated the ability to control the temperature uniformityof a substrate 134 processed thereon to less than about ±0.3 degreesCelsius.

Another benefit of some embodiments of the substrate support assembly126 is the ability to prevent RF power from traveling through controlcircuitry. For example, the tuning heater controller 202 may include anelectrical power circuit 210 and an optical controller 220. Theelectrical power circuit 210 is coupled to the spatially tunable heaters140. Each spatially tunable heater 140 has a pair of power leads(connectors 250) which are connected to the electrical power circuit210. In an exemplary heater assembly 170 having fifty spatially tunableheaters 140, 60 hot and 1 common power lead (connectors 250) are neededfor controlling the spatially tunable heaters 140. The RF energysupplied into the processing chamber 100 for forming the plasma couplesto the power leads. Filters, such as the RF filters 182, 184, 186 shownin FIG. 1, are used to protect electrical equipment, such as the mainheater power source 156, from the RF energy. By terminating the powerleads (connectors 250) at the electrical power circuit 210, andutilizing the optical controller 220 to each spatially tunable heater140, only the single RF filter 184 is needed between the electricalpower circuit 210 and the power source 156. Instead of each heaterhaving a dedicated RF Filter, the spatially tunable heaters are able touse one RF filter which significantly reduces the number of RF filtersrequired. The space for dedicated RF filters is very limited, and thenumber of heaters utilized within the substrate support assembly is alsolimited. Therefore, the number of main heater zones is not limited andimplementing spatially tunable heaters becomes possible. Thus, the useof the electrical power circuit 210 with the optical controller 220allow more heaters, and consequently, superior lateral temperaturecontrol.

The electrical power circuit 210 may switch or cycle power to theplurality of connectors 250. The electrical power circuit 210 providespower to each of the connectors 250 to activate one or more spatiallytunable heaters 140. Although the electrical power source ultimatelysupplies power to the plurality of spatially tunable heaters 140, theelectrical power circuit 210 has a single power source, i.e. the tuningheater power source 142, and thus only requires only the single filter184. Advantageously, the space and expense for additionally filters aremitigated, while enabling use of many heaters and heater zones.

The optical controller 220 may be coupled to the electrical powercircuit 210 by a fiber optic interface 226, such as a fiber optic cable,to control the power supplied to the connectors 250 and thus, thespatially tunable heaters 140. The optical controller 220 may be coupledto the optical converter 178 through an optical wave guide 228. Theoptical converter 178 is coupled to the controller 148 for providingsignals controlling the function of the spatially tunable heaters 140.The fiber optic interface 226 and optical wave guide 228 are not subjectto electromagnetic interference or radio frequency (RF) energy. Thus, anRF filter to protect the controller 148 from RF energy transmission fromthe tuning heater controller 202 is unnecessary, thereby allowing morespace in the substrate support assembly 126 for routing other utilities.

The optical controller 220 may send commands, or instruction, to theelectrical power circuit 210 for regulating each spatially tunableheater 140 or groups/regions of spatially tunable heaters 140. Eachspatially tunable heater 140 may be activated using a combination of apositive lead and a negative lead, i.e., the connectors 250, attached tothe electrical power circuit 210. Power may flow from electrical powercircuit 210 over the positive lead to the spatially tunable heater 140and return over the negative lead back to the electrical power circuit210. In one embodiment, the negative leads are shared amongst thespatially tunable heaters 140. Thus, the spatially tunable heaters 140would each have an individual dedicated positive lead while sharing acommon negative lead. In this arrangement, the number of connectors 250from the electrical power circuit 210 to the plurality of spatiallytunable heaters 140 is one more than the number of spatially tunableheaters 140. For example, if the substrate support assembly 126 has onehundred (100) spatially tunable heaters 140, there would be 100 positiveleads and 1 negative lead for a total of 101 connectors 250 between thespatially tunable heaters 140 and the electrical power circuit 210. Inanother embodiment, each spatially tunable heater 140 has a separatenegative lead connecting the spatially tunable heater 140 to theelectrical power circuit 210. In this arrangement, the number ofconnectors 250 from the electrical power circuit 210 to the spatiallytunable heaters 140 is twice the number of spatially tunable heaters140. For example, if the substrate support assembly 126 has one hundred(100) spatially tunable heaters 140, there would be 100 positive leadsand 100 negative leads for a total of 200 connectors 250 between thespatially tunable heaters 140 and the electrical power circuit 210.

The optical controller 220 may be programmed and calibrated by measuringthe temperature at each spatially tunable heater 140. The opticalcontroller 220 may control the temperature by adjusting the powerparameters for individual spatially tunable heaters 140. In oneembodiment, the temperature may be regulated with incremental powerincreases to the spatially tunable heaters 140. For example, atemperature rise may be obtained with a percentage increase, for example9% increase, in the power supplied to the spatially tunable heater 140.In another embodiment, the temperature may be regulated by cycling thespatially tunable heater 140 on and off. In yet another embodiment, thetemperature may be regulated by a combination of cycling andincrementally adjusting the power to each spatially tunable heater 140.A temperature map may be obtained using this method. The map maycorrelate the CD or temperature to the power distribution curve for eachspatially tunable heater 140. Thus, the spatially tunable heater 140 maybe used to generate a temperature profile on the substrate based on aprogram regulating power settings for the individual spatially tunableheaters 140. The logic can be placed directly in the optical controller220 or in an externally connected controller, such as the controller148.

The arrangement of the spatially tunable heaters 140 will now bediscussed with reference to FIGS. 4A through 4D. FIG. 4A is across-sectional view of FIG. 2 along a section line A-A, according toone embodiment. FIGS. 4B-3D are cross-sectional views along the samesection line A-A of FIG. 2, according to alternate embodiments.

Referring now to FIG. 4A, the plurality of spatially tunable heaters 140are disposed along the plane of the cross section line A-A through thebody 152 of the heater assembly 170. The thermal choke 216 is disposedbetween each neighboring cell 200, each cell 200 associated with atleast one of the of spatially tunable heaters 140. Additionally, thethermal choke 216 is disposed along an outer surface 426 of thesubstrate support assembly 126. The number of cells 200 shown is forillustration only, and any number of embodiments may have substantiallymore (or less) cells 200. The number of spatially tunable heaters 140may be at least an order of magnitude greater than the number of mainresistive heaters 154. The number of spatially tunable heaters 140located across the substrate support assembly 126 may easily be inexcess of several hundred.

Each spatially tunable heater 140 has a resistor 404 ending in terminals406, 408. As current enters one terminal, such as the terminal labeled406, and exists the other terminal, such as the terminal labeled 408,the current travels across the wire of the resistor 404 and generatesheat. The spatially tunable heater 140 may have a design power densityto provide the appropriate temperature rise along the outer surface 426of the substrate support assembly 126. The amount of heat released bythe resistor 404 is proportional to the square of the current passingtherethrough. The power design density may be between about 1 watt/cellto about 100 watt/cell, such as 10 watt/cell.

The resistor 404 may be formed from a film of nichrome, rhenium,tungsten, platinum, tantalum or other suitable materials. The resistor404 may have an electrical resistivity (ρ). A low ρ indicates a materialthat readily allows the movement of an electric charge across theresistor 404. The resistance (R) is dependent on the ρ times the length(l) over the cross sectional area (A) of the wire, or simply R=ρ·l/A.Platinum has a ρ of about 1.06×10⁻⁷ (Ω·m) at 20° C. Tungsten has a ρ ofabout 6.60×10⁻⁸ (Ω·m) at 20° C. Nichrome has a ρ of about 1.1×10⁻⁸ toabout 1.5×10⁻⁸ (Ω·m) at 20° C. Of the three aforementioned materials,the resistor 404 comprised of nichrome allows the electrical charge tomove more readily, and thus, generate more heat. However, the electricalproperties for tungsten may differentiate the material as a resistiveheater in certain temperature ranges.

The resistor 404 may have a film thickness (not shown) and a wirethickness 472 configured to efficiently provide heat when a current ispassed along the resistor 404. An increase in the wire thickness 472 forthe resistor 404 may result in a decrease in the resistance R of theresistor 404. The wire thickness 472 may range from about 0.05 mm toabout 0.5 mm for a tungsten wire and about 0.5 mm to about 1 mm for anichrome wire.

Recalling the formula R=ρ·l/A, it can be seen that the material, lengthof wire, and the wire thickness may be selected for the resistor 404 tocontrol cost, power consumption, and the heat generated by eachspatially tunable heater 140. In one embodiment, a resistor 404 iscomprised of tungsten having a wire thickness 472 of about 0.08 mm and aresistance of about 90 Ohms at 10 watts of power.

The spatially tunable heaters 140 may be configured in a pattern 490 toefficiently generate a heat profile along the surface of the substratesupport assembly 126. The pattern 490 may be symmetric about a midpoint492 while providing clearance in and around holes 422 for lift pins orother mechanical, fluid or electrical connections. Each spatiallytunable heater 140 may be controlled by the tuning heater controller202. The tuning heater controller 202 may turn on a single spatiallytunable heater 140 defining a heater 440; or a plurality of spatiallytunable heaters 140 grouped to define an inner wedge 462, a perimetergroup 464, a pie shaped area 460, or other desired geometricconfiguration, including non-contiguous configurations. In this manner,temperature can be precisely controlled at independent locations alongthe surface of the substrate support assembly 126, such independentlocations not limited to concentric ring such as known in the art.Although the pattern shown is comprised of smaller units, the patternmay alternatively have larger and/or smaller units, extend to the edge,or have other forms.

FIG. 4B is a top view of the plurality of spatially tunable heaters 140disposed along the plane of the cross section line AA through the body152, according to another embodiment. The thermal chokes 216 mayoptionally be present. The spatially tunable heaters 140 are arranged inthe form of a grid, thus defining an array of temperature control cells200 also arranged in the grid pattern. Although the grid pattern ofspatially tunable heaters 140 is shown as an X/Y grid comprised of rowsand columns, the grid pattern of spatially tunable heaters 140 mayalternatively have some other uniformly packed form, such as a hexagonclose pack. It should be appreciated, as discussed supra, the spatiallytunable heaters 140 may be activated in groups or singularly.

FIG. 4C is a top view of the plurality of spatially tunable heaters 140disposed along the plane of the cross section line AA through the body152, according to another embodiment. FIG. 4C illustrates a plurality ofspatially tunable heaters 140 arranged in a polar array in the body 152.Optionally, one or more of thermal chokes 216 may be disposed betweenthe spatially tunable heaters 140. The polar array pattern of thespatially tunable heaters 140 defines the neighboring cells 200, whichare thus also be arranged in a polar array. Optionally, thermal chokes216 may be utilized to isolate adjacent cells 200 from neighboring cells200.

FIG. 4D is a top view of the plurality of spatially tunable heaters 140disposed along the plane of the cross section line A-A through the body152, according to another embodiment. FIG. 4D illustrates a plurality ofspatially tunable heaters 140 arranged in the body 152 in concentricchannels. The concentric channel pattern of the spatially tunableheaters 140 may be optionally separated by thermal chokes 216. It iscontemplated that the spatially tunable heaters 140 and cells 200 may bearranged in other orientations.

The number and density of the spatially tunable heaters 140 contributeto the ability for controlling the temperature uniformity across thesubstrate to very small tolerances which enables precise process and CDcontrol when processing the substrate 134. Additionally, individualcontrol of one spatially tunable heaters 140 relative to anotherspatially tunable heaters 140 enables temperature control at specificlocations in the substrate support assembly 126 without substantiallyaffecting the temperature of neighboring areas, thereby allowing localhot and cool spots to be compensated for without introducing skewing orother temperature asymmetries. The spatially tunable heaters 140 mayhave an individual temperature range between about 0.0 degrees Celsiusand about 10.0 degrees Celsius with the ability to control thetemperature rise in increments of about 0.1 degrees Celsius. In oneembodiment, the plurality of spatially tunable heaters 140 in thesubstrate support assembly 126 in conjunction with the main resistiveheaters 154 have demonstrated the ability to control the temperatureuniformity of a substrate 134 processed thereon to less than about ±0.3degrees Celsius. Thus, the spatially tunable heaters 140 allow bothlateral and azimuthal tuning of the lateral temperature profile of thesubstrate 134 processed on the substrate support assembly 126.

Turning to FIG. 5, a graphical depiction is provided for a wiring schemafor the main resistive heaters 154 and the spatially tunable heaters140. The wiring schema provides for individual control, as opposed tomultiplex control, over the spatially tunable heaters 140. Theindividual control provides any one spatially tunable heater 140, orselection of spatially tunable heaters 140, can be made active at thesame time as any other spatially tunable heater 140, or selection ofspatially tunable heaters 140. The wiring schema allows the independentcontrol of an output to one of the plurality of spatially tunableheaters relative to another of the plurality of spatially tunableheaters. Thus, the spatially tunable heaters 140 do not have the powercycled between an on and an off state in order to allow power to otherspatially tunable heater 140, or selection of spatially tunable heaters140. This arrangement without cycling the power at the spatially tunableheaters advantageously allows a quick response time at the spatiallytunable heaters 140 for achieving a desired temperature profile.

The main resistive heaters 154 and the spatially tunable heaters 140 maybe attached to a control board 502. The control board 502 is attached toa power source 578 through a single RF filter 510. Since each heater154, 140 shares the single RF filter 510 and does not have its own RFfilter, space in the substrate support assembly 126 is conserved andadditionally costs associated with the additional filters areadvantageously mitigated. Control board 502 is similar to controller 202shown in FIGS. 1 and 2, and has a similar version of the electricalcontroller 210 and the optical controller 220. The control board 502 maybe internal or external to the substrate support assembly 126. In oneembodiment the control board 502 is formed between the facility plate180 and the cooling base 130.

The spatially tunable heaters 140 _((1-n)) are figuratively shown andshould be understood that spatially tunable heater 140 ₁ may represent alarge group of spatially tunable heaters in a common zone, oralternatively, to all the spatially tunable heaters 140 disposed acrossthe substrate support assembly 126. There are an order of magnitude morespatially tunable heaters 140 than main heaters 154, and therefore, anorder of magnitude more connections to the electrical controller 210 andthe optical controller 220.

The electrical controller 210 accepts a plurality of connectors 512 fromthe spatially tunable heaters 140 through one or more holes or slots 520formed through the cooling base 130. The connectors 512 may contain anumber of connections suitable for communicating between the spatiallytunable heaters 140 and the electrical controller 210. The connectors512 may be a cable, individual wires, a flat flexible cable such as aribbon, a mating connector, or other suitable methods/means fortransmitting signals between the spatially tunable heaters 140 and theelectrical controller 210. In one embodiment, the connectors 512 areribbon cables. The connectors 512 will be discussed using the term powerribbon 512.

The power ribbon 512 may be connected at one end to the spatiallytunable heaters 140 in the ESC 132 and connect at the other end to theelectrical controller 210. The power ribbon 512 may connect to theelectrical controller via direct wiring, a socket, or suitablereceptacle. In one embodiment, the electrical controller 210 has asocket configured for a high density of connections. The power ribbons512 may use high density connectors to provide the large number ofconnections, such as 50 or more connections, from the spatially tunableheaters 140 to the electrical controller 210. The electrical controller210 may have a high density interconnect (HDI) with a wiring density perunit area greater than conventional printed circuit boards. The HDI mayinterface with the high density connector of the power ribbon 512. Theconnector advantageously allows a high density of connections and easyassembly and disassembly of the substrate support assembly 126. Forexample, the ESC 132 may require maintenance, resurfacing or replacingand the connectors provide a quick and easy means of removing the ESC132 for maintenance and quickly reconnecting the ESC 132 back to thesubstrate support assembly 126.

The electrical controller 210 may additionally accept a plurality ofpower ribbons 522 from the main resistive heaters 154 through the slot520 formed through the cooling base 130. The power ribbons 512, 522,graphically depict a number of power leads for each spatially tunableheater 140 and main resistive heater 154. For example, power ribbon 512includes a plurality of separate positive and negative power leads foreach spatially tunable heater 140. Likewise, power ribbon 522 comprisesseparate positive and negative power leads for each main resistiveheater 154. In one embodiment, each power lead has a switch 560 managedby the optical controller 220. The switch 560 may reside in theelectrical controller 210, on the control board 502 or other suitablelocation. It is contemplated that a single ribbon, or even three or moreequally spaced ribbons, may be utilized to route the power leads for thespatially tunable heaters 140 and main resistive heater 154. The equallyspaced ribbons enhance field uniformity and thus uniformity ofprocessing results.

The optical controller 220 is connected to an external controller (148in FIG. 1) and is configured to provide instructions to the electricalcontroller for powering each spatially tunable heater 140. The opticalcontroller 220 accepts a plurality of control ribbons 540 for managingthe spatially tunable heaters 140. In one embodiment, the controlribbons 540 are imbedded in the control board 502 and connect theoptical controller 220 to the electrical controller 210. For example,the control ribbons 540 may be circuitry connecting the two controllers210, 220. In another embodiment, the control ribbon may attach theoptical controller 220 to the electrical controller 210 via a cable orother suitable connection external to the control board 502. In yetanother embodiment, the control ribbon 540 may pass through the slot 520formed through the cooling base and manage each spatially tunable heater140 individually.

The optical controller 220 may optionally accept a plurality of controlribbons 550 for managing the main resistive heaters 154. Alternatively,the main resistive heaters may be managed by a second optical controlleror by an external controller. Similar to the control ribbon 540, controlribbon 550 may be imbedded in the control board 502 or attached to themain resistive heaters 154. Alternately, the main resistive heaters maynot have a control ribbon 550 and the cycling and intensity of the powermay be managed external at the power source 138.

The ribbons 540, 550 graphically depict a number of control leads foreach spatially tunable heater 140 and main resistive heater 154. Forexample, control ribbon 540 comprises separate positive and negativecontrol leads for a plurality of spatially tunable heaters 140. Theoptical controller 220 may take input, from a program, temperaturemeasuring device, an external controller, a user or by other source, anddetermines which spatially tunable heaters 140 and/or main resistiveheaters 154 to manage. As the optical controller 220 uses optics tocommunicate with other devices, such as the electrical controller 210,the optical controller is not subject to RF interference and does notpropagate the RF signal to regions outside of the processing chamber. Itis contemplated that a single ribbon, or even three or more ribbons, maybe utilized to route the control leads.

The control ribbons 540 provide signals generated by the opticalcontroller 220 to control the state of a switch 560. The switch 560 maybe a field effect transistor, or other suitable electronic switch.Alternately, the switch 560 may be embedded in an optically controlledcircuit board in the electrical controller 210. The switch 560 mayprovide simple cycling for the heaters 154, 140 between an energized(active) state and a de-energized (inactive) state.

The controller 202 may control at least one or more of the duty cycle,voltage, current, or duration of power applied to one or more selectedspatially tunable heaters 140 relative another and at the same time. Inone embodiment, the controller 202 provides a signal along the controlribbon 540 ₁ to instruct the switch 560 ₁ to allow 90% of the power topass therethrough. The electrical controller 210 provides about 10 wattsof power along the power ribbon 512 ₁. The switch 560 ₁ allows 90% ofthe supplied power to pass through to a spatially tunable heater 140 ₁which heats up with about 9 watts of power.

In another embodiment, the controller 202 provides a signal along thecontrol ribbon 550 ₂ to instruct the switch 560 ₂ to allow 100 percentof the power to pass therethrough. The electrical controller 210provides about 100 Watts of power along the power ribbon 522 ₂. Theswitch 560 ₂ allows 100 percent of the supplied power to pass through tothe main resistive heater 154 ₂ which heats up with about 100 Watts ofpower. Similarly, the main resistive heaters 154 _((1-N)) may all beoperated from controller 202.

In yet another embodiment, the tuning heater controller 202 provides asignal along the control ribbon 540 to instruct the switches 560 to bein either an active state that allows power to pass therethrough or aninactive state that prevents power from passing therethrough. Theelectrical controller 210 provides about 10 Watts of power along thepower ribbon 512 to each individual spatially tunable heater 140 coupledto a switch 560 in the active state. The tuning heater controller 202independently controls at least one of the duration that the switch 560remains in the active state and the duty cycle of each of the switch 560relative to the other switches 560, which ultimately controls thetemperature uniformity of the substrate support assembly 126 andsubstrate positioned thereon. The switches 560 controlling power to themain resistive heaters 154 may be similarly controlled.

In another embodiment, each main resistive heater 154 _((1-N)),representing a separate zone, may have a separate controller 202. Inthis embodiment, the spatially tunable heaters_((1-N)) common to a zonewith one main resistive heater 154 _((1-N)) may share the controller 202with the common main resistive heater 154 _((1-N)). For example, ifthere were four zones, there would be four main resistive heaters 154₍₁₋₄₎ and four equally spaced controllers 202.

In other embodiments, separate controllers 202 may be utilized to splitup the number of spatially tunable heaters 140 serviced by a singlecontroller. For instance, each control ribbon 540 may have a separateoptical controller 220 for managing a set number of spatially tunableheaters 140 individual. Splitting up the control of the spatiallytunable heaters 140 allows for smaller controllers and less spacerequired routing the ribbons through the slots 520 formed through thecooling base.

Turning to FIG. 6, a graphical depiction is provided for another wiringschema for the main resistive heaters 154 and the spatially tunableheaters 140. The wiring schema depicted in FIG. 6 provides forindividual control of the spatially tunable heaters 140. The spatiallytunable heaters 140 are attached to the tuning heater controller 202.The electrical controller 210 on the control board 502 is attached tothe power source 156 through the filter 184. The optical controller 220is connected to an external controller (148 in FIG. 1) and is configuredto provide instructions to the electrical controller for powering eachspatially tunable heater 140. The optical controller 220 communicatesthrough the fiber optic interface 226 with the electrical controller 210to manage the spatially tunable heaters 140. Similar to the wiringschema of FIG. 5, the wiring schema of FIG. 6 provides for independentcontrol of an output of one of the plurality of spatially tunableheaters relative to the other spatially tunable heaters.

The main resistive heaters 154 may optionally be attached to a tuningheater controller 202′, the tuning heater controller 202, or othercontroller external from the substrate support assembly 126. The tuningheater controller 202′ may be substantially similar to the tuning heatercontroller 202. It should be appreciated that the control of the mainresistive heaters 154 may be similar to that described for the spatiallytunable heaters 140. Alternately, the main resistive heaters 154 may bemanaged externally as shown in FIG. 1.

The spatially tunable heaters 140 _((1-n)) are figuratively shown andshould be understood that spatially tunable heater 140 ₁ may represent alarge group of spatially tunable heaters in a common zone, oralternatively, to all the spatially tunable heaters 140 disposed acrossthe substrate support assembly 126. Each spatially tunable heater 140has a connector 250 for transmitting power to the spatially tunableheater 140 from the electrical controller 210.

The electrical controller 210 accepts a plurality of power ribbons 612from the spatially tunable heaters 140 through one or more holes orslots 520 formed through the cooling base 130. The ribbons 612graphically depict a number of power leads for each spatially tunableheater 140. The power ribbon 612 provides an electrical pathway forpower to the spatially tunable heaters 140. In one embodiment, the powerribbon 612 comprises separate positive power leads for each spatiallytunable heater 140. The power ribbon 612 may optionally have a singlenegative power lead common to all the spatially tunable heaters 140attached to the power ribbon 612. Alternately, the power ribbon 612 mayhave no negative power return path and the return path for theelectrical current may be provided through a separate cable, a commonbus, or other suitable means. In another embodiment, the power ribbon612 comprises separate negative power leads for each spatially tunableheater 140. The power ribbon 612 may optionally have a single positivepower lead common to all the spatially tunable heaters 140 attached tothe power ribbon 612. Alternately, the power ribbon 612 may have nopositive power supply path and the power supply path for the electricalcurrent may be provided through a separate cable, a common bus, or othersuitable means.

Turing briefly to FIG. 7, FIG. 7 is a perspective view of a bottom 794of the electrostatic chuck 132, configured for the wiring schemadepicted in FIG. 6. The electrostatic chuck 132 may have a plurality ofelectrodes 742 for supplying a chucking force to a substrate deposed onthe electrostatic chuck 132. Power ribbons 612 may be electricallyattached to the bottom 794 of the electrostatic chuck 132 having thespatially tunable heaters 140 formed therein. The power ribbons 612 maybe a flat flexible cable (FFC) or flexible printed circuit (FPC), suchas a polyimide flat flexible cable, having a connector 712 at one endand contacts 720 at the other end. The connector 712 connects to theelectrical controller 210. The connector 712 may be individual wires, asocket connector, a plug, a high density connector such as those usedwith flat flexible cables or flexible printed circuits, or othersuitable connector. The contacts 720 may attach to the electricalconnections formed in the electrostatic chuck 132, i.e. the vias. Thecontacts 720 may be soldered, glued or attached by other means to theelectrostatic chuck 132. Alternately, the contacts 720 may be formed indirect connection to the spatially tunable heaters 140, such as wiredpower leads. The contacts 720 may have a combined area in contact withthe electrostatic chuck 132 which is about less than a 0.75 inchdiameter circle. This minimal area the contacts 720 have with theelectrostatic chuck 132 reduces heat transfer from the electrostaticchuck 132 to the cooling base 130. The contacts 720 may be circular,rectangular, semi-circular or any other shape. The power ribbon 612 mayhave more than one contact 720 and thus a hundred or more leads. Thus, asingle power ribbon 612 may be able to connect and individually controlmany spatially tunable heaters 140, depending on the wiring connectionconfiguration to the electrical controller 210, such as sharing a commonnegative lead. In one embodiment, the electrostatic chuck 132 has sixpower ribbons 612 equally spaced and soldered thereon. The power ribbons612 may each have twenty-five soldered contacts 720.

Alternately, the power ribbons 612 may be replaced with a pin/receptacleconnector. Turning briefly to FIG. 10, FIG. 10 illustrates across-sectional view for a mating connector 1010 connecting the ESC 132to the tuning heater controller 202. The mating connector 1010 may besized to pass through the slot 520 in the cooing base 130 to provide aconnection between the tuning heater controller 202 and the ESC 132. Themating connector 1010 may have a flange 1008. The flange 1008 may bedisposed between the cooling base 130 and the tuning heater controller202. A gap 1050 may be formed between the cooling base 130 and thetuning heater controller 202. Alternately, the tuning heater controller202 may have a cutout, notch, hole, void, or other opening which allowsthe mating connector 1010 to pass therethrough and substantially reducethe gap 1050 between the tuning heater controller 202 and the coolingbase 130.

The mating connector 1010 may have a first end 1002 and a second end1004. The first end 1002 may interface with the ESC 132. The second end1004 may interface with the tuning heater controller 202. A plurality ofcontact pins 1012, 1014 interface with a plurality of pin receptacles1020, 1022 to provide an electrical connection between the ESC 132 andthe tuning heater controller 202. The pins 1012, 1014 may be about 0.3mm or less. The pins 1012, 1014 have a corresponding plurality of pinreceptacles 1020, 1022 configured to accept the pins 1012, 1014 andprovide electrical continuity. The pins 1012, 1014 or pin receptacles1020, 1022 may be formed on one or more of the first and second end1002, 1004 of the mating connector 1010 and interface between the ESC132 and the tuning heater controller 202.

The mating connector 1010 may provide a direct physical electricalconnection between the tuning heater controller 202 and the ESC 132. Forexample, receptacles may be formed on the tuning heater controller 202which accept pins 1014. Thus, cooling base 130 may be placed directly onthe ESC 132, the mating connector 1010 inserted through the slot 520 inthe cooling base 130, and the tuning heater controller 202 placed onmating connector 1010 to form a connection between the ESC 132 and thetuning heater controller 202. Alternately, the mating connector 1010 mayutilize a cable, ribbon or flat connector to complete the connectionbetween the tuning heater controller 202 and the ESC 132.

Advantageously, the mating connector 1010 may have a smallcross-sectional area which correspondingly requires little open space inthe cooling base 130 which minimizes the thermal conductance ordisturbance of the cooling base 130 for better thermal uniformity.Additionally, the mating connector 1010 may protect the connections fromthe processing environment and extend the longevity for the electricalconnections.

Returning back to FIG. 6, the electrical controller 210 may have aplurality of switches 660 formed therein. Each switch 660 may accept apositive power lead from one of the power ribbons 612 to controlindividual spatially tunable heaters 140. The optical controller 220manages the switches 660 via a fiber optic interface 226 to theelectrical controller 210. Circuitry 640 may be imbedded in theelectrical controller 210 or the tuning heater controller 202 to convertthe optical signal to an electrical signal for provided instructions tothe switches 660.

The switches 660 may be a field effect transistor, or other suitableelectronic switch. The switch 660 may provide simple cycling for theheaters 154, 140 between an energized (active) state and a de-energized(inactive) state. Alternately, the switch 660 may be another suitabledevice, which can control the amount of power supplied to the spatiallytunable heaters 140.

The switches 660 may be formed internal to the substrate supportassembly 126, such as in the electrostatic chuck 132, the cooling base130, heater assembly 170 and the facility plate 180. Alternately, theswitched 660 may be formed external to the substrate support assembly126 or even the processing chamber 100, such as in the controller 148.

Turning to FIG. 8, FIG. 8 illustrates a bottom perspective view for thecooling base 130, configured for the wiring schema depicted in FIG. 6.The cooling base 130 may have a bottom surface 894, a plurality ofcooling passages (not shown in FIG. 8), and passages 842. The coolingpassages may be configured to circulate a cooling fluid therethrough toregulate the temperature of the electrostatic chuck 132. The passages842 may be configured to allow the electrodes 742 supplying power to theelectrostatic chuck 132 to pass through the cooling base 130. Thepassages 842 may be electrically insulated to provide protection fromthe electrodes 742 energizing the cooling base 130. Additionally, thecooling base may have one or more slots 520. The slots 520 may beconfigured to allow the ribbon 612 to pass from the electrostatic chuck132 internally through the cooling base 130 to the bottom surface 894.

The electrical controller 210 may be disposed on the bottom surface 894of the cooling base 130. The electrical controller 210 is mounted in anRF environment and thus communication with the electrical controller 210may be performed via fiber optics while the power to the electricalcontroller 210 may be supplied through an RF filter. The electricalcontroller 210 may have a send 826 and a receive 828 fiber opticinterface 226. The fiber optic interface 226 provides an opticalconnection to the optical controller 220. The fiber optic interface 226is immune to RF and other electrical interference and therefore does notrequire a filter to protect connected devices/controller, such as theoptical controller 220.

The tuning heater controller 202 may have a plurality of sockets 812.The sockets 812 may be configured to connect with the connectors 712attached to the end of the ribbons 612. The sockets may provide fifty ormore individual connections for each the ribbon 612. The electricalcontroller 210 may consist of a substrate 830 with a plurality ofcircuits 832, 834 formed thereon. The plurality of circuits 832, 834 mayinclude transistors, resistors, capacitors and other electrical featuresfor forming switches and controlling the flow of power to the individualconnection in the sockets 812. The electrical controller 210 maytherefore manage individual the spatially tunable heaters 140 bycontrolling at least one or more of the duty cycle, voltage, current, orduration of power applied over the individual connections in the sockets812 attached to the ribbons 612.

In one embodiment, the switches 660 are formed on the electricalcontroller 210. Ribbons 612 with connectors 712 pass through the slots520 in the cooling base 130 to connect the spatially tunable heaters 140in the electrostatic chuck 132 to the electrical controller 210. Theconnectors 712 connect the ribbons 612 to the sockets 812 on theelectrical controller 210. The optical controller 220 provides opticalsignals to the electrical controller 210 through the fiber opticinterface 226 for controlling the power to individual connections in thesocket 812. The combination of the optical controller 220 and electricalcontroller 210 allows any selection of individual spatially tunableheaters 140 to be simultaneously powered and or cycled on and off tocreate a desired temperature profile on a substrate disposed on theelectrostatic chuck 132. The use of the high density interconnectsenables independent control of a large number of spatially tunableheaters 140 and therefore enhanced control of the temperature profile.Advantageously, the independent control of the spatially tunable heaters140 allows for a high duty cycle per individual spatially tunable heater140 and a larger dynamic temperature range. Thus, the individual controlof the spatially tunable heaters 140 provide more power per unit timealong with a quick response time.

FIG. 9 is a flow diagram for one embodiment of a method 900 forprocessing a substrate utilizing a substrate support assembly, such asthe substrate support assembly described above, among others. The method900 begins at block 902 by applying power to a main resistive heaterformed in a substrate support assembly. The main resistive heater may bea single heater, or segmented into zones. The main resistive heaterzones may be independently controllable.

At block 904, power is provided to a plurality of individual spatiallytunable heaters distributed about the substrate support assembly. Atuning heater controller individually controls power to each spatiallytunable heater. At least two of the spatially tunable heaters generate apredetermined different amount of heat. The difference in heat generatedby one spatially tunable heater relative another may be controlled bycontrolling at least one or more of the duty cycle, voltage, current,duration of power applied to any one spatially tunable heater relativeanother. The power supplied to the spatially tunable heaters may also besequentially scanned across individual spatially tunable heaters.

The control for each spatially tunable heater can be performedsimultaneous in the electrostatic chuck 132 allowing any selection ofspatially tunable heaters to quickly generate a specific temperatureprofile. Control of the power provided to the individual spatiallytunable heaters may be provide through an external controllerinterfacing over an optical connection to the tuning heater controllerdisposed in the substrate support assembly. Thus, the externalcontroller is isolated from RF by the optical connection to the tuningheater controller.

At block 906, a workpiece, such as a substrate, may be processed on thesubstrate support assembly. For example, the substrate may be processedin a vacuum chamber, for example using a plasma process. The vacuumprocess, which may be optionally performed in the presence of a plasmawithin the processing chamber, may be one of etching, chemical vapordeposition, physical vapor deposition, ion implantation, plasmatreating, annealing, oxide removal, abatement or other plasma process.It is contemplated that the workpiece may be processed on thetemperature controlled surface in other environments, for example, atatmospheric conditions, for other applications.

Optionally, at block 906, power provided to the individual spatiallytunable heaters distributed laterally within the substrate supportassembly may be changed in response to process conditions or a change ina process recipe. For example, the power provided to one or more ofspatially tunable heaters may be changed utilizing commands from thetuning heater controller. Thus, the tuning heater controller maysimultaneously provide power to one spatially tunable heater whilecycling another spatially tunable heater and cycling still otherspatially tunable heaters at different overlapping time intervals.

While the foregoing is directed to implementations of the presentinvention, other and further implementations of the invention may bedevised without departing from the basic scope thereof, and the scopethereof is determined by the claims that follow.

We claim:
 1. A substrate support assembly, comprising: a body having asubstrate support surface and a lower surface; one or more mainresistive heaters disposed in the body; a plurality of spatially tunableheaters disposed in the body; and a spatially tunable heater controllercoupled to the plurality of spatially tunable heaters, the spatiallytunable heater controller configured to independently control an outputone of the plurality of spatially tunable heaters relative to another ofthe plurality of spatially tunable heaters.
 2. The substrate supportassembly of claim 1, wherein the body is an electrostatic chuck.
 3. Thesubstrate support assembly of claim 2, wherein the body is formed from aceramic material.
 4. The substrate support assembly of claim 1, whereinthe body has vias formed therein between the spatially tunable heatersand a mounting surface of the body.
 5. The substrate support assembly ofclaim 4, further comprising: a plurality of high density connectorsattached to the vias and disposed on the mounting surface.
 6. Thesubstrate support assembly of claim 5, wherein ribbons are soldered ontothe high density connectors at the mounting surface of the body.
 7. Thesubstrate support assembly of claim 5, wherein a matting connectorprovides an electrical connection between the high density connectors atthe mounting surface of the body and the spatially tunable heatercontroller.
 8. The substrate support assembly of claim 1, furthercomprising: a cooling base, wherein the cooling base has one or moreslots formed there through.
 9. The substrate support assembly of claim8, wherein the spatially tunable heater controller comprises: anelectrical controller, wherein the electrical controller is configuredto provide power individually to each spatially tunable heater; and anoptical controller connected to an external controller and configured totransmit instructions to the electrical controller for powering eachspatially tunable heater.
 10. The substrate support assembly of claim 9,wherein the spatially tunable heater controller has a single RF filterattached thereto.
 11. The substrate support assembly of claim 9, whereinthe spatially tunable heater controller is disposed below a bottomsurface of the cooling base.
 12. A substrate support assembly,comprising: a cooling base having a plurality of slots formedtherethrough; a body having a substrate support surface and a lowersurface; one or more main resistive heaters disposed in the body; aplurality of spatially tunable heaters disposed in the body; and aplurality of high density conductors coupled to the spatially tunableheaters, the high density conductors extending through the slots formedthrough the cooling base.
 13. The substrate support assembly of claim12, wherein the body is an electrostatic chuck.
 14. The substratesupport assembly of claim 13, wherein the body is formed from a ceramicmaterial.
 15. The substrate support assembly of claim 12, furthercomprising: a spatially tunable heater controller coupled by theplurality of high density conductors to the plurality of spatiallytunable heaters, the spatially tunable heater controller configured toindependently control an output one of the plurality of spatiallytunable heaters relative to another of the plurality of spatiallytunable heaters.
 16. The substrate support assembly of claim 15, whereinthe body has vias formed therein between the spatially tunable heatersand a mounting surface of the body, and the high density connectors aresoldered to the vias at the mounting surface of the body.
 17. Thesubstrate support assembly of claim 15, wherein the spatially tunableheater controller comprises: an electrical controller, wherein theelectrical controller is configured to provide power individually toeach spatially tunable heater; and an optical controller connected to anexternal controller and configured to transmit instructions to theelectrical controller for powering each spatially tunable heater,wherein the spatially tunable heater controller has a single RF filterattached thereto.
 18. The substrate support assembly of claim 17,wherein the spatially tunable heater controller is disposed below abottom surface of the cooling base.
 19. A method for controlling atemperature of a workpiece, comprising: applying power to a mainresistive heater formed in a substrate support; providing power to aplurality of spatially tunable heaters, wherein power to each spatiallytunable heater is individually controlled by a tuning heater controller;processing the workpiece on the substrate support; and changing thepower provided to individual spatially tunable heater in response toprocess conditions or changes in a process recipe.
 20. The method ofclaim 19, further comprising: controlling the tuning heater controllerto send power to each spatially tunable heater with an externalcontroller isolated from RF by an optical connection to the tuningheater controller.
 21. The method of claim 20, wherein the tuning heatercontroller simultaneously provides power to spatially tunable heaters atdifferent overlapping time intervals.